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Senior Staff Engineer Wirebond R&D
Company | Infineon Technologies |
Address | Batam, Indonesia |
Employment type | FULL_TIME |
Salary | |
Category | Manufaktur Peralatan Rumah Tangga, Peralatan Listrik, dan Elektronik,Manufaktur Perangkat Keras Komputer,Manufaktur Semikonduktor |
Expires | 2023-05-28 |
Posted at | 1 year ago |
As an R&D Engineer, you will develop new processes and ensure design to cost & design to manufacturing, actively challenging current processes and looking for improvement, efficiencies, and value engineering. In your new role you will:
- Perform Wire Bonding process characterization and define the workable process window.
- Process enabler for new package development, ramp, platform extension, and innovation.
- Derive and define new process design guidelines for new package technologies.
- Define and characterize new process/equipment/tooling and road map activities.
- Conduct process knowledge transfer and end-to-end collaboration with the operation.
- Identify problems or deviations, recommend and implement corrective actions.
- Good interpersonal skills, proactive, and high teamwork spirit of collaborating with cross sites counterparts.
- Bachelor's degree in engineering (electrical/electronic, mechanical, materials, or another relevant course).
- Minimum 10 years of working experience in the Wire Bonding process with hands-on ability.
- Good analytical and problem-solving skills.
- Required to travel overseas for work when needed
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